Classification of vacuum coating films

Vacuum coating technology is generally divided into two categories, namely physical vapor deposition (PVD) technology and chemical vapor deposition (CVD) technology.

Physical vapor deposition technology refers to a method of depositing electroplated materials directly on the substrate surface by gasification into atoms and molecules or ionization into ions under vacuum conditions by various physical methods. Hard reactive membranes are mostly prepared by physical vapor deposition. Some physical processes, such as thermal evaporation of materials or sputtering of atoms on the surface of materials under ion bombardment, are used to realize the controlled transfer process of atoms from the source material to the membrane. Physical vapor deposition technology has the advantages of good film-base bonding strength, uniform and compact film layer, controllable film thickness, wide target surface, wide sputtering range, thick film deposition, stable alloy film composition, good repeatability and so on. At the same time, because the machining temperature can be controlled below 500℃, the physical vapor deposition method can be used as the machining process of HSS and cemented carbide film tools. Because physical vapor deposition technology can improve the cutting performance of cutting tools, people are competing to develop high performance and high reliability equipment, but also expand its application field, especially in the application of high speed steel, cemented carbide and ceramic tools have been more in-depth research.

Chemical vapor deposition technique is to contain membrane elements or compounds of elemental gas supply base material, with the aid of gas phase or chemical reaction on the surface of the base material, the preparation of metal or compound thin films on the matrix method, mainly including atmospheric pressure chemical vapor deposition, low pressure chemical vapor deposition and the characteristics of both CVD and PVD plasma chemical vapor deposition, etc.